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Gold Plated MultiPin Headers / Hermetic Glass to Metal Seals Kovar 4J29 Material

Hermeticity Leak Rate: < 1.01325×10-3 Pa*cm³/s, < 1×10-9 ccHe/sec @ 1 atm, < 1×10-9 mbar*l/s
Impedance: 50 ohm
Insulation Resistance: ≥1000MΩ for multi-pin, ≥2000MΩ for single pin
Shell Finish: Gold Plated
Shell Material: Kovar 4J29
Withstand Voltage: ≥300V
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Gold Wire Bonding Surface Glass to Metal Seal Connectors 4Pin Nail Head

Hermeticity Leak Rate: < 1.01325×10-3 Pa*cm³/s, < 1×10-9 ccHe/sec @ 1 atm, < 1×10-9 mbar*l/s
Impedance: 50 ohm
Insulation Resistance: ≥1000MΩ for multi-pin, ≥2000MΩ for single pin
Shell Finish: Gold Plated
Shell Material: Kovar 4J29
Withstand Voltage: ≥300V
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Hermetic Glass to Metal Seal Connectors Nail HeadPin Tip RF Feedthroughs

Hermeticity Leak Rate: < 1.01325×10-3 Pa*cm³/s, < 1×10-9 ccHe/sec @ 1 atm, < 1×10-9 mbar*l/s
Impedance: 50 ohm
Insulation Resistance: ≥1000MΩ for multi-pin, ≥2000MΩ for single pin
Shell Finish: Gold Plated
Shell Material: Kovar 4J29
Withstand Voltage: ≥300V
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Hermetic Glass to Metal Seal Connectors RF Feedthroughs Extend Insulation

Hermeticity Leak Rate: < 1.01325×10-3 Pa*cm³/s, < 1×10-9 ccHe/sec @ 1 atm, < 1×10-9 mbar*l/s
Impedance: 50 ohm
Insulation Resistance: ≥1000MΩ for multi-pin, ≥2000MΩ for single pin
Shell Finish: Gold Plated
Shell Material: Kovar 4J29
Withstand Voltage: ≥300V
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Hermetic Glass to Metal Seal Connectors RF Feedthroughs Multi-pin Headers

Hermeticity Leak Rate: < 1.01325×10-3 Pa*cm³/s, < 1×10-9 ccHe/sec @ 1 atm, < 1×10-9 mbar*l/s
Impedance: 50 ohm
Insulation Resistance: ≥1000MΩ for multi-pin, ≥2000MΩ for single pin
Shell Finish: Gold Plated
Shell Material: Kovar 4J29
Withstand Voltage: ≥300V
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Hermetic Glass to Metal Seal Connectors Right Angle Pin RF Feedthroughs

Hermeticity Leak Rate: < 1.01325×10-3 Pa*cm³/s, < 1×10-9 ccHe/sec @ 1 atm, < 1×10-9 mbar*l/s
Impedance: 50 ohm
Insulation Resistance: ≥1000MΩ for multi-pin, ≥2000MΩ for single pin
Shell Finish: Gold Plated
Shell Material: Kovar 4J29
Withstand Voltage: ≥300V
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Hermetic Glass to Metal Seal Connectors Straight Cut Pin Tip DC Feedthroughs

Hermeticity Leak Rate: < 1.01325×10-3 Pa*cm³/s, < 1×10-9 ccHe/sec @ 1 atm, < 1×10-9 mbar*l/s
Impedance: 50 ohm
Insulation Resistance: ≥1000MΩ for multi-pin, ≥2000MΩ for single pin
Shell Finish: Gold Plated
Shell Material: Kovar 4J29
Withstand Voltage: ≥300V
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Hermetic RF Feedthroughs Glass to Metal Seal Connectors Pierced Pin

Hermeticity Leak Rate: < 1.01325×10-3 Pa*cm³/s, < 1×10-9 ccHe/sec @ 1 atm, < 1×10-9 mbar*l/s
Impedance: 50 ohm
Insulation Resistance: ≥1000MΩ for multi-pin, ≥2000MΩ for single pin
Shell Finish: Gold Plated
Shell Material: Kovar 4J29
Withstand Voltage: ≥300V
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Hermetic Single Pin Connector 50ohm RF Impedance For Aerospace Small Size

Hermeticity Leak Rate: < 1.01325×10-3 Pa*cm³/s, < 1×10-9 ccHe/sec @ 1 atm, < 1×10-9 mbar*l/s
Impedance: 50 ohm
Insulation Resistance: ≥2000MΩ
Shell Finish: Gold Plated
Shell Material: Kovar 4J29
Withstand Voltage: ≥300V
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High Precision Glass to Metal Seal Connectors With Extended Insulator

Hermeticity Leak Rate: < 1.01325×10-3 Pa*cm³/s, < 1×10-9 ccHe/sec @ 1 atm, < 1×10-9 mbar*l/s
Impedance: 50 ohm
Insulation Resistance: ≥1000MΩ for multi-pin, ≥2000MΩ for single pin
Shell Finish: Gold Plated
Shell Material: Kovar 4J29
Withstand Voltage: ≥300V
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High Reliability Glass to Metal Seal Connectors Multi Pin Header Gold Plated

Hermeticity Leak Rate: < 1.01325×10-3 Pa*cm³/s, < 1×10-9 ccHe/sec @ 1 atm, < 1×10-9 mbar*l/s
Impedance: 50 ohm
Insulation Resistance: ≥1000MΩ for multi-pin, ≥2000MΩ for single pin
Shell Finish: Gold Plated
Shell Material: Kovar 4J29
Withstand Voltage: ≥300V
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High Reliability Sealing Hermetic Feedthrough 50ohm RF Impedance Lightweight

Hermeticity Leak Rate: < 1.01325×10-3 Pa*cm³/s, < 1×10-9 ccHe/sec @ 1 atm, < 1×10-9 mbar*l/s
Impedance: 50 ohm
Insulation Resistance: ≥1000MΩ for multi-pin, ≥2000MΩ for single pin
Shell Finish: Gold Plated
Shell Material: Kovar 4J29
Withstand Voltage: ≥300V