Hermetic RF Feedthroughs Glass to Metal Seal Connectors Pierced Pin
- Pierced pin design ensures reliable electrical contact with minimal mechanical stress, perfect for RF applications
- Glass to metal seal provides a hermetically sealed, leak-proof connection, ideal for use in vacuum, high-pressure, and extreme environments
- RF feedthrough design minimizes signal loss, ensuring stable, high-frequency signal transmission with minimal interference
- Optimized for industries like aerospace, defense, telecommunications, and medical, where reliability and performance are crucial
- Built for durability in harsh conditions, providing stable performance under temperature extremes, vibration, and mechanical stress
Glass to Metal Hermetic RF/DC Feedthroughs/Seals /Multi-pin Headers /Connector is also called Glass insulator. They are mainly used to transmit microwave signals, power signals and control signals between modules and modules, modules and components with gas sealing requirements. They are one of the most critical components in sealing components. The glass with low dielectric constant and low dielectric loss is used as insulating and supporting material. The housing and conductor is made of Kovar alloy that sintered under high temperature, and the surface is gold plated. The centerconductor has a variety of termination styles such as gold wire bonding, soldering and mating etc. Glass insulators are small, lightweight, hermetic, high reliable and have been widespread in electronics manufacturing industries in recent years.
Structure
Glass insulator is composed of three parts: outer conductor/shell, glass medium and center conductor/pin.Its basic structure is shown in the figure.
Reliability Requirements
Hermeticity
≤1.01325×10-³Pa·cm³/s/s
Salt spray
Glass insulators shall be tested without severe corrosion and spotting.
Temperature shock
There shall be no cosmetic or mechanical damage after testing.
Applications
High Temperature Sensors
Implanted Medical Devices
Batteries and Capacitors
Automotive Airbag
Our Advantages
Production Process
1. Put forward demand
2. Sketch design
3. Production equipment
4. Production measurement
5. Product assembly
6. Quality test
7. Product packaging
8. Product packag box
9. Deliver goods
Product Specification
Impedance | 50 ohm |
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Number of Positions | 1 Pin |
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Row | 1 |
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Shell Finish | Gold Plated |
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Shell Material | Kovar 4J29 |
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Glass Material | 7050, 7070, DM308 |
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Glass Color | Green, White |
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Frequency Range | DC-50 GHz |
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VSWR | ≤1.20 |
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Withstand Voltage | ≥300V |
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Hermeticity Leak Rate | < 1.01325×10-3 Pa*cm³/s, < 1×10-9 ccHe/sec @ 1 atm, < 1×10-9 mbar*l/s |
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Insulation Resistance | ≥1000MΩ for multi-pin, ≥2000MΩ for single pin |
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Operating Temperature | -65℃ to +260℃ |
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Impedance | 50 ohm |
Number of Positions | 1 Pin |
Row | 1 |
Shell Finish | Gold Plated |
Shell Material | Kovar 4J29 |
Glass Material | 7050, 7070, DM308 |
Glass Color | Green, White |
Frequency Range | DC-50 GHz |
VSWR | ≤1.20 |
Withstand Voltage | ≥300V |
Hermeticity Leak Rate | < 1.01325×10-3 Pa*cm³/s, < 1×10-9 ccHe/sec @ 1 atm, < 1×10-9 mbar*l/s |
Insulation Resistance | ≥1000MΩ for multi-pin, ≥2000MΩ for single pin |
Operating Temperature | -65℃ to +260℃ |
Impedance | 50 ohm |
---|---|
Number of Positions | 1 Pin |
Row | 1 |
Shell Finish | Gold Plated |
Shell Material | Kovar 4J29 |
Glass Material | 7050, 7070, DM308 |
Glass Color | Green, White |
Frequency Range | DC-50 GHz |
VSWR | ≤1.20 |
Withstand Voltage | ≥300V |
Hermeticity Leak Rate | < 1.01325×10-3 Pa*cm³/s, < 1×10-9 ccHe/sec @ 1 atm, < 1×10-9 mbar*l/s |
Insulation Resistance | ≥1000MΩ for multi-pin, ≥2000MΩ for single pin |
Operating Temperature | -65℃ to +260℃ |
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